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1layer Flexible Printed Circuit Board 0.13mm Thickness Immersion Gold With FR4 Stiffener

GT SMART (Changsha) Technology Co., Limited
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    Buy cheap 1layer Flexible Printed Circuit Board 0.13mm Thickness Immersion Gold With FR4 Stiffener from wholesalers
     
    Buy cheap 1layer Flexible Printed Circuit Board 0.13mm Thickness Immersion Gold With FR4 Stiffener from wholesalers
    • Buy cheap 1layer Flexible Printed Circuit Board 0.13mm Thickness Immersion Gold With FR4 Stiffener from wholesalers
    • Buy cheap 1layer Flexible Printed Circuit Board 0.13mm Thickness Immersion Gold With FR4 Stiffener from wholesalers

    1layer Flexible Printed Circuit Board 0.13mm Thickness Immersion Gold With FR4 Stiffener

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    Brand Name : Customized
    Certification : ISO9001
    Price : Negotiation
    Payment Terms : Negotiation, T/T
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    1layer Flexible Printed Circuit Board 0.13mm Thickness Immersion Gold With FR4 Stiffener

    Flex Printed Circuit Board (FPC) is made of flexible insulating substrates (mainly polyimide PI or polyethylene terephthalate PET), which can be freely bent, wound, folded, and can withstand hundreds of thousands to millions of bends without damage.


    Product specification:

    Product TypeFlexible Circuit board
    Layer1OZ
    Board thickness0.13mm
    Surface finishImmersion gold
    SoldermaskYellow coverlay
    SilkscreenWhite
    TechnologyDifferent FR4 stiffener thickness at different area

    Flexible circuit board addvantages:

    FPC can be bent and folded, providing greater freedom in the design and operation of applications. FPC can also adapt to small spaces or irregularly shaped spaces, which is a function that standard rigid pcbs do not possess.

    FPC occupy less space, thereby reducing the weight of the application motherboard. In addition to optimizing space utilization, it can also achieve better thermal management, then reducing the amount of heat to be dissipated.


    Compared to rigid PCBs, flexible printed circuits are also more reliable and durable, especially in applications where the circuit can withstand continuous vibration and mechanical stress. The standard interconnection technology based on welding wires and manual wiring connectors has been replaced by flexible printed circuits. The characteristics of flexible printed circuits are extremely light weight, extremely thin thickness, high mechanical resistance, high temperature and atmospheric resistance, and good electromagnetic interference (EMI) resistance.


    The use of FPC can reduce the incidence of human errors during the wiring process, thereby improving quality and reducing costs. FPC technology helps significantly reduce the size and weight of applications, which is a key factor in creating reliable, compact, and highly integrated electronic devices.

    Quality 1layer Flexible Printed Circuit Board 0.13mm Thickness Immersion Gold With FR4 Stiffener for sale
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