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Customer First , People Orientated
3 Years
| Ask Lasest Price | |
| Brand Name : | Customisation |
| Certification : | ISO9001, TS16949 |
| Price : | Negotitation |
| Payment Terms : | Negotitation, T/T |
Product description:
| Product type | Printed circuit board Assembly |
| Multilayer | 6 layer |
| Material | FR4 Tg135 1.6mm |
| Copper thickness | 2/1/1/1/1/2OZ |
| Surface finish | Immersion gold |
| Soldermask | Black |
PCBA :Assembly Tehcnologies:
Surface Mount Technology (SMT): Components are mounted directly onto the surface of the PCB. This technology allows for smaller components and denser PCB layouts.
Through-Hole Technology (THT): Components with wire leads are inserted into holes in the PCB and soldered on the opposite side. THT is used for components requiring mechanical strength or heat dissipation.
Automated Optical Inspection (AOI): AOI systems use cameras and image processing algorithms to inspect solder joints and components for defects such as misalignment, missing components, or solder bridges.
X-Ray Inspection: X-ray machines are used to inspect hidden solder joints, check for voids in solder, and ensure the integrity of components like ball grid arrays (BGAs).
In-Circuit Testing (ICT): ICT involves testing the electrical connections on the PCB using test probes. This method is used to detect faults like open circuits, shorts, and incorrect components.
Flying Probe Testing: Instead of using dedicated test fixtures, flying probe testers have moving test probes that can adapt to various PCB designs, making them suitable for low-volume production.
Functional Testing: This involves testing the PCB while it is operational to ensure that it functions according to the design specifications.These processes and technologies collectively ensure the quality and reliability of PCB assemblies in electronic devices.
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